薄物多層プリント配線板の製造方法

Manufacture for thin multilayer printed wiring board

Abstract

(57)【要約】 【課題】 ビアホール,バイアホールを有する薄物多層 プリント配線板において、ビアホール接続用パッド部の 占有面積を小さく形成し、層間接続の自由度が向上し、 高密度化を実現でき接続信頼性の高い製造方法を提供す ること。 【解決手段】 本発明の薄物多層プリント配線板の製造 方法は、内外層にビアホール形成の場合に、内層ビアホ ール同一の軸上に接続用パッドを介して外層ビアホール を形成し、前記ビアホールにテーパ角をもち層間接続信 頼性の向上を図り、占有面積を小さく達成できるもので ある。
PROBLEM TO BE SOLVED: To enable forming of vias at the front and back and reduce the connecting pad length by providing outermost layer vias having a tapering angle coaxially to inner layer vias at the opposite side to connecting pads formed on an epoxy film with an inner layer conductor to allow the small- occupied area connecting pad length to be reduced. SOLUTION: A Cu foil epoxy film 5 is photo etched to form connect pads 3A, and Cu foils 1, 2, insulator 4 etc., are formed. For forming via-half-through- holes 6, 6A, 12, 14, a laterally excited atmospheric pressure CO2 laser beam is used, thus enabling very fine via processing giving the advantage to layer interconnection reliability and high-density forming. The process is made until reaching the connecting pads 3A. Roughening to activate is followed by a thick electroless Cu plating to form conductive connection holes (vias) 23, small- occupied-area outermost layer vias 19, 20 coaxial to inner layer vias 10A, 10B and land layer 22.

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    Publication numberPublication dateAssigneeTitle
    JP-2001308548-ANovember 02, 2001Lg Electronics Inc, エルジー電子株式会社Multilayer printed circuit board, manufacturing method thereof and bga semiconductor package formed utilizing the same